INFREDAR

NNVT 9B-3 Electron Bombarded Active Pixel Sensor Module(EBAPS)

Discover the NNVT 9B-3 EBAPS digital low-light imaging module, integrating vacuum photoelectron technology with a high-performance CMOS design. Engineered for all-weather operation, it delivers 1.3 MP resolution (1280×1024) at 60 fps, an ultra-wide 380–1100 nm spectral range, and an ultra-lightweight 72g module profile. Available with Camera Link (NV2409) or USB/SDI (YV2409) interfaces, it is the ideal core solution for tactical night vision, airborne payloads, and digital optoelectronic fusion systems. 

9B-3 EBAPS Electron Bombarded Active Pixel Sensor Module (NV2409 / YV2409)

Engineered specifically for autonomous unmanned systems, airborne reconnaissance pods, and advanced tactical payloads, the 9B-3 EBAPS (Electron Bombarded Active Pixel Sensor) module delivers state-of-the-art digital low-light imaging performance. Independently developed by North Night Vision Technology (NNVT), this vacuum-based digital sensor bridges the gap between traditional high-sensitivity image intensifiers and solid-state digital processing, providing a high-performance, SWaP-optimized core for next-generation multi-spectral fusion and all-digital night vision architectures.

Core Technological Advantages for Unmanned Systems & OEM Integration

1. Direct Electron Bombardment Architecture

Unlike conventional CMOS sensors that suffer signal degradation through multi-stage optical conversion, EBAPS accelerates photoelectrons emitted from the vacuum photocathode and bombards the CMOS pixel array directly. This architecture eliminates intermediate optical transfer loss, yielding outstanding quantum efficiency, ultra-high internal gain, rapid response times, and an exceptional signal-to-noise ratio under extreme low-light environments.

2. All-Weather Day and Night Dual-Mode Imaging

The 9B-3 EBAPS supports a wide dynamic illuminance range from 5 × 10⁻⁵ lx to 100 lx. Operators and autonomous control systems can switch seamlessly between two operational modes: Day mode disables high voltage for standard optical imaging, while Night mode activates high voltage to enable electron-bombardment low-light imaging, ensuring round-the-clock operational readiness.

3. Real-Time 1.3MP Digital Output & Broad Spectral Response

Featuring a native 1280 × 1024 (1.3MP) resolution with a 9.76 µm pixel pitch, the module supports smooth, real-time video streaming up to 60 fps. Its broad spectral response spans from 380 nm to 1100 nm, effectively covering visible light and near-infrared (NIR) bands. This wide spectrum is critical for tracking NIR laser markers, illuminators, and executing multi-spectral fusion.

4. Superior SWaP (Size, Weight, and Power) Optimization

Designed to minimize payload constraints on weight-sensitive platforms, the sensor core weighs 21 g or less, while the complete YV2409 module weighs only 72 g, with total power consumption kept below 1.5 W. This ultra-lightweight profile reduces aerodynamic drag and power drain on UAV gimbals and UGV payloads.

Technical Specifications

Parameter Item NV2409 (Camera Link Version) YV2409 (USB / SDI Version) Remarks
Sensor Type 1-inch Electron Bombarded Active Pixel Sensor (EBAPS) 1-inch Electron Bombarded Active Pixel Sensor (EBAPS) 1-inch target size
Resolution 1280 × 1024 (1.3 MP) 1280 × 1024 (1.3 MP) High-resolution digital output
Pixel Size / Shutter 9.76 µm / Rolling Shutter 9.76 µm / Rolling Shutter Optimized pixel geometry
Dynamic Illuminance Range 5 × 10⁻⁵ ~ 100 lx 5 × 10⁻⁵ ~ 100 lx Works for both day & night modes
Spectral Response 380 ~ 1100 nm 380 ~ 1100 nm Visible light to near infrared
Max Frame Rate 60 fps 60 fps Real-time high frame video
Digital Video Output Camera Link USB Type-C / SDI Direct digital stream
Communication & Control Interface RS485 (J30J-9ZKNP5-J connector) USB Type-C (with on-board flash storage) Flexible host control
Lens Mount Standard C-Mount (M25.4) Standard C-Mount (M1-32, imperial thread) Standard industrial lens interface
Overall Dimension ≤ 34.7 × 34.7 × 60.5 mm ≤ 35 × 35 × 55.6 mm Compact form factor
Weight Sensor ≤ 21 g / Total ≤ 92 g Sensor ≤ 21 g / Total ≤ 72 g Ultra-light module design
Power Consumption < 1.5 W ≤ 1.5 W Low-power operation
Operating Temperature -45°C ~ +55°C -45°C ~ +55°C Military & industrial wide temperature tolerance

Dual Interface Options for Specialized Integration

  • NV2409 (Camera Link Version): Built with a high-bandwidth Camera Link video port and a robust J30J connector with integrated RS485 control. It matches industrial frame-grabber hardware and meets the stringent, low-latency requirements of heavy-duty military vehicles and UAV onboard avionics systems. Total module weight: ≤ 92 g.
  • YV2409 (USB / SDI Version): Equipped with plug-and-play USB Type-C and standard SDI video outputs. Features on-board flash storage to enable direct capture and export of image and video data. Total module weight: ≤ 72 g, making it the ideal choice for rapid prototyping, portable reconnaissance units, and lightweight gimbals.

Core B2B Application Focus: Unmanned Systems & Airborne Reconnaissance

Modern defense integrators increasingly favor digital low-light architectures over traditional analog intensifiers because digital pipelines seamlessly integrate with AI target recognition, onboard processing computers, and digital video transmission links. The 9B-3 EBAPS module is purpose-built for these advanced deployment vectors:

  • UAV (Unmanned Aerial Vehicle) Payloads & Gimbals: Provides lightweight, high-frame-rate low-light imaging for tactical reconnaissance drones, letting small-to-medium UAS conduct persistent night surveillance without exceeding payload weight limits.
  • UGV (Unmanned Ground Vehicle) & Autonomous Vehicles: Serves as the vision core for driver-vision enhancement and remote-controlled combat vehicles operating in zero-light or starlight conditions.
  • Airborne Reconnaissance & Pod Systems: Integrated into helicopter and fixed-wing targeting pods for high-clarity night navigation and border patrol missions.
  • Digital Tactical Optics & AI HUDs: Powers next-generation digital weapon sights and helmet-mounted fusion systems where low latency and digital metadata overlay are essential.

Get Datasheet, Samples & OEM Pricing

Infredar Tech supplies authentic NNVT EBAPS sensors and digital imaging modules directly to global distributors, defense contractors, and optoelectronic hardware manufacturers.

For detailed technical datasheets, evaluation samples, volume discount pricing, or customized interface adaptation support, please reach out to our engineering sales team at:
sales@infredar.com